The Interface Electronics for an Ultrasonic Matrix Transducer for 3d Transesophageal Echocardiography
نویسندگان
چکیده
In this paper, the design considerations of a mixed-signal integrated circuit for a 2D matrix ultrasonic transducer will be presented. The IC and the matrix transducer will be put into the tip of a transesophageal (TEE) probe for 3D echocardiography. The challenges associated with the interface electronics include: addressing the huge amount of elements, do the beam steering in the transmission mode and beam forming in the reception mode; keep the power consumption as low as possible; fit the electronics into a limited space, etc. The block diagram and the design constraints of the IC will be discussed. A layout scheme for the IC and the matrix transducer will also be described.
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